At present, there are more than 1,000 LED packaging enterprises above designated size in China, of which 2/3 are distributed in the Pearl River Delta region. According to statistics, there are more than 1,800 LED industry enterprises in Shenzhen, which is the most concentrated area of ​​the national LED industry. Shenzhen LED packaging, display, lighting product quality, output and export volume are among the highest in the country. In the industrial sector, the LED package production capacity has been formed to be oversupply. The market competition has intensified, resulting in a continuous decline in product prices. Many small and medium-sized manufacturers have difficulties in operating and the industry will continue to reshuffle. At present, there are more than 1,000 LED packaging enterprises above designated size in China, of which 2/3 are distributed in the Pearl River Delta region. According to statistics, there are more than 1,800 LED industry enterprises in Shenzhen, which is the most concentrated area of ​​the national LED industry. Shenzhen LED packaging, display, lighting product quality, output and export volume are among the highest in the country. In the industrial chain, it has formed a complete industrial chain of equipment-material-chip-package-application, and is one of the largest LED packaging bases and application product development bases in China. LED production equipment: including MOVVD equipment, liquid phase outer plating furnace, lithography machine, dicing machine, automatic solid crystal machine, gold wire ball welder, silicon aluminum wire ultrasonic welding machine, glue filling machine, vacuum oven, Chip counter, chip detector, film laminating machine, light color point automatic sorting machine, etc. Raw materials for LED luminescent materials and devices: including substrate material gallium arsenide single crystal, aluminum nitride single crystal, and the like. Most of them are IIIV compound semiconductor single crystals, and the production process is relatively mature. Other materials include metal high-purity gallium. The purity of raw materials is generally above 6N. LED chip: mainly refers to the epitaxial fabrication and chip manufacturing of LED luminescent materials. Due to the high development of the epitaxial process, the main structures of the device such as the light-emitting layer, the confinement layer, the buffer layer and the reflective layer have been completed in the epitaxial process, and the chip fabrication mainly performs positive and negative electrodes and completes the segmentation detection. LED packaging: In the semiconductor industry, the LED packaging industry is different from other semiconductor device packaging industries. It can package a wide variety of LED lighting devices of different colors and shapes according to different occasions such as reality, lighting, and communication. LED application: refers to the industry formed after the application of LED display or lighting devices. In terms of LED applications, the surface should be wider, and should also include information display in home appliances, meters, and light industrial products, but these are not enough to support the LED downstream industry. The main application industries include LED display, LED traffic lights, solar battery LED navigation lights, LCD backlights, LED lights, LED landscape lighting, and LED special lighting.

Anti-corrosion refers to the protection of metal surfaces from corroding in high-risk (corrosive) environments.
When metallic materials are put into corrosive environments, they tend to have chemical reactions with the air and/or water. The effects of corrosion become evident on the surfaces of these materials. For example, after putting a piece of iron into a corrosive atmosphere for an extended period, it starts rusting due to oxygen interaction with water on the surface of the piece of iron.

Anti-corrosion Series

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